Accomplishments
(Note: VB2/Ron is the Figure of Merit (FOM). The higher the FOM, the better the device.)


 
Unipolar Devices
Device Drift Layer Doping Concentration
(cm-3)
Drift Layer Thickness 
(um)
Blocking Voltage
(kV)
Specific On-Resistance
(mOhm-cm2)
VB2/Ron
(MW/cm2)
JBS Diode
(4H)
1.4 x 1015 45 5.96 24 1,480
Schottky Diode 
(4H)
 5.6 x 1014 115  10.8 97 1,202
TI-VJFET 
(4H, normally-on)
7 x 1015 9.4 1.71 2.77 1,056
TI-VJFET 
(4H)
 4.9 x 1014   120 11 130 930
TI-VJFET 
(4H)
 7 x 1015   9.4 1.72 3.6 828
MPS Diode
(4H)
2 x 1015 30 4.28 25.6 717
MPS Diode
(4H)
6.6 x 1015 10.3 1.78 6.68 474
Planar VJFET
(4H)
1.9 x 1015 30 4.34 40 471
Planar VJFET
(4H)
5.7 x 1015 15 1.53 17.5 134
 
PiN diode and GTO
Device Drift Layer Doping Concentration
(cm-3)
Drift Layer Thickness 
(um)
Rating Specific On-Resistance
(mOhm-cm2)
PiN  (4H)  1 x 1015 29  5kV-100A 637A/cm2
@4.5V and 200C
GTO  (4H)  7.2 x 1015   7 810V 1000A/cm2
@4.5V
 
Bipolar Junction Transistors
Device Drift Layer Doping Concentration
(cm-3)
Drift Layer Thickness 
(um)
Current Gain Blocking Voltage
(V)
Specific On-Resistance
(mOhm-cm2)
VB2/Ron
(MW/cm2)
BJT (4H) 7 x 1014 50 7 9,300 49 1,765
BJT (4H) 6.7 x 1015 12 8.8 1,836 4.7 717
BJT (4H) 7.3 x 1015 12 70 1600 5.1 502
BJT (4H) 5.0 x 1015 12 33 1036 2.9 370
BJT (4H) 8.5 x 1015 12 24.8 1750 12 255
BJT (4H) 8.5 x 1015 12 18.8 757 2.9 198
Darlington 
BJT (4H)
8.5 x 1015 12 462 1570 16.7 148
BJT (4H) 6 x 1015 12 47 500 8.7 29
Darlington 
BJT (4H)
6 x 1015 12 1517 500 12.9 19.4
 
World's First SiC Power IC
Device Lateral Drift Layer Doping Con. (cm-3 ) Lateral Drift Layer Thickness 
(um)
Power Switching Frequency
(MHz)
Blocking Voltage
(V)
Specific On-Resistance
(mOhm-cm2)
 
JFET
JFET1

(4H)
2 x 1017 1.0 10 1,000 9.1
 
SiC Single Photon Detectors
Demonstration of 4H-SiC UV Single Pnoton Counting Avalanche Photodiode
4H-SiC Single Photon Avalanche Diode for 280nm UV Applications